LOAD LOCK Chamber (option)
LOAD LOCK预真空进样室（可选）
Chamber with front open door
前开门蒸发腔体
Cryopump and dry pump
冷凝泵和干泵
Multiple thermal evaporation sources or OLED sources
多个热阻蒸发源或OLED低温蒸发源
Max. 6” substrate
6”基片
Substrate rotation
基片旋转
Substrate bias (option)
基片偏压（可选）
Ion source for substrate cleaning (option)
离子源清洗基片（可选）
Substrate heating to 1000C (option)
基片加热1000度(可选)
Crystal rate monitor and film thickness control
晶振沉积速率及膜厚控制
Manual or automatic system control
系统手动或自动控制
For deposition of metal, semiconductor and insulation materials
可沉积金属、半导体和绝缘材料
For deposition of multi-layer or alloy film
可沉积多层膜及合金薄膜